Probe tip arrangement in dense pad array, has aggressor conductor located in close proximity to the access transmission line, where redefined capacitance is created between conductor and transmission line

摘要

A grid of pads (103) are located in dense pad array (100). A probe tip resistor (106) has one end (109) coupled to the pad and other end (113) coupled to access transmission lines (123a-123d). A probe tip resistor (119) is located outside the dense pad array and coupled to transmission line. An aggressor conductor is located in close proximity to the transmission line. A redefined capacitor is created between the aggressor conductors and the transmission line. The resistor (106) has a resistance (RT1) and a resistor (119) has a resistance (RT2) being predetermined to minimize the amount of cross-talk between the aggressor for conductor and the transmission line. Independent claims are also included for the following: (a) Interposer; (b) Pad probing method in dense pad array