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Method for forming patterns of dense conductor lines and their contact pads, and memory array having dense conductor lines and contact pads

机译:形成密集导体线及其接触垫的图案的方法以及具有密集导体线和接触垫的存储器阵列

摘要

A method for forming patterns of dense conductor lines and their contact pads is described. Parallel base line patterns are formed over a substrate. Each of the base line patterns is trimmed. Derivative line patterns and derivative transverse patterns are formed as spaces on the sidewalls of the trimmed base line patterns, wherein the derivative transverse patterns are formed between the ends of the derivative line patterns and adjacent to the ends of the trimmed base line patterns. The trimmed base line patterns are removed. At least end portions of the derivative line patterns are removed, such that the derivative line patterns are separated from each other and all or portions of the derivative transverse patterns become patterns of contact pads each connected with a derivative line pattern.
机译:描述了用于形成密集导体线及其接触焊盘的图案的方法。平行基线图案形成在基板上。修剪了每个基线图案。导数线图案和导数横向图案形成为在修整的基线图案的侧壁上的空间,其中,导数横向图案形成在导数线图案的端部之间并且与修整的基线图案的端部相邻。修剪的基线图案将被删除。去除导数线图案的至少端部,使得导数线图案彼此分离,并且导数横向图案的全部或部分变为均与导数线图案连接的接触焊盘的图案。

著录项

  • 公开/公告号US9006911B2

    专利类型

  • 公开/公告日2015-04-14

    原文格式PDF

  • 申请/专利权人 JONATHAN DOEBLER;SCOTT SILLS;

    申请/专利号US201213472498

  • 发明设计人 JONATHAN DOEBLER;SCOTT SILLS;

    申请日2012-05-16

  • 分类号H01L29/40;H01L21/768;

  • 国家 US

  • 入库时间 2022-08-21 15:20:20

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