Electronic component, e.g. an automobile electronic ignition module, comprises a filled resin housing encapsulating a hybrid integrated circuit substrate and a tin-antimony soldered power semiconductor on a heat sink

摘要

An electronic component comprises a filled resin housing encapsulating a hybrid integrated circuit substrate (2) and a tin-antimony soldered power semiconductor (3) on a heat sink (1). A resin-encapsulated electronic component comprises a hybrid integrated circuit substrate (2) and a power semiconductor (3) fixed on a metal heat sink (1), the power semiconductor (3) being fixed to the heat sink (1) by an Sn-Sb alloy solder (4) and all the elements (1, 2, 3), together with a portion of one or more input/output connections (6-3), being embedded in a housing (7) formed by pressure injection of an epoxide containing 70-90 wt.% inorganic filler. An independent claim is also included for production of the above component. Preferred Features: The hybrid integrated circuit substrate has a conductor of Ag-Pt alloy or Cu and components are soldered onto the substrate (2) by an Sn-Ag or Sn-Ag-Cu alloy solder.