Methods for X-ray test of mounting or connection status of ball grid arrays and chip scale packages by irradiating sample with x-rays from x-ray source that rotates together with X-ray detector about same line

摘要

X-ray detector (12) swings about a line (S), which is in the surface plane of a section to be tested (13a). The sample (13) is irradiated with x-rays of a x-ray source (11) that rotates together with the x-ray detector (12) about the line (S). The x-rays penetrating through the sample (13) are recorded using the x-ray detector (12). An Independent claim is included for: (a) a X-ray test device