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PRESSURE SENSITIVE STRUCTURAL ADHESIVES AND SEALANTS BASED ON TELECHELIC / HETEROTELECHELIC POLYMERISATES WITH DOUBLE CURING
PRESSURE SENSITIVE STRUCTURAL ADHESIVES AND SEALANTS BASED ON TELECHELIC / HETEROTELECHELIC POLYMERISATES WITH DOUBLE CURING
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机译:基于双固化的远距离/非远距离聚合物的压力敏感结构粘合剂和密封剂
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摘要
Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.
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