Method and device for wave soldering with integrated dry flow method

摘要

A process is claimed for the wave soldering of a circuit, during which the circuit (1) is put in contact with at least one wave (45) of a liquid soldering alloy obtained by pumping, from a liquid bath of the alloy contained in a tank (46), across at least one nozzle (44). Prior to the soldering operation each of the faces of the circuit are, at a pressure close to atmospheric pressure, subjected to a fluxing operation by being fed with gas leaving at least one apparatus (4,12,11) for the formation of excited or unstable gas species from an initial gas mixture containing an inert gas and/or a reducing gas and/or an oxidising gas from which is obtained a primary gas mixture including excited or unstable gas species and essentially devoid of electrically charged species. The wave soldering device is also claimed and comprises: (a) a covering structure (3), defining an inner space (13) through which the circuits will pass; (b) at least two apparatuses (4,11,12) for the formation of excited or unstable gas species, mounted in series; and (c) a tank (46) containing a bath of the soldering alloy.