Surface mountable integrated circuit, useful as a ball pin grid array surface mounted device for an electronic card, comprises low melting alloy balls soldered around ends of connection pins

摘要

A surface mountable integrated circuit (IC) has low melting alloy balls (44), consisting of a lead-tin alloy, e.g. a 63% Pb/37% Sn alloy, soldered around ends of connection pins (42). An Independent claim is also included for production of the above IC.