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Triple polysilicon flash EEPROM arrays having a separate erase gate for each row of floating gates, and methods of manufacturing such arrays

机译:具有用于每一行浮栅的单独的擦除栅的三层多晶硅闪存EEPROM阵列及其制造方法

摘要

As part of a flash EEPROM array on a semiconductor substrate, erase gates are formed in individual trenches between rows of floating gates. The erase gate is positioned along one sidewall of the trench in a manner to be capacitively coupled with the floating gates of one of the rows adjacent the trench but spaced apart from the floating gates of the other row adjacent the trench. In this way, a separate erase gate is provided for each row of floating gates without increasing the size of the array. The erasure of each row can then be individually controlled. Two self- aligned methods of forming such an array are disclosed. One method involves forming a thick insulating layer along one sidewall of the trench and then filling a remaining space adjacent an opposite trench sidewall with polysilicon material forming an erase gate for the row of floating gates adjacent the other sidewall. A second method involves anisotropically etching a layer of polysilicon that is formed over the array in a manner to conform to the trench sidewalls, thereby separating the polysilicon layer into individual erase gates carried by the trench sidewalls.
机译:作为半导体衬底上的快速EEPROM阵列的一部分,擦除栅极形成在浮栅行之间的各个沟槽中。擦除栅极沿着沟槽的一个侧壁定位,以与邻近沟槽的那一行的浮动栅极电容耦合,但与邻近沟槽的另一行的浮动栅极间隔开。这样,在不增加阵列尺寸的情况下,为每行浮栅提供了单独的擦除栅。然后可以分别控制每一行的擦除。公开了形成这种阵列的两种自对准方法。一种方法涉及沿着沟槽的一个侧壁形成厚的绝缘层,然后用多晶硅材料填充相对的沟槽侧壁附近的剩余空间,从而形成与另一侧壁相邻的一排浮栅的擦除栅极。第二种方法涉及各向异性蚀刻在阵列上形成的多晶硅层,其方式与沟槽侧壁一致,从而将多晶硅层分离成沟槽侧壁承载的各个擦除栅极。

著录项

  • 公开/公告号US6028336A

    专利类型

  • 公开/公告日2000-02-22

    原文格式PDF

  • 申请/专利权人 SANDISK CORPORATION;

    申请/专利号US19970908264

  • 发明设计人 JACK H. YUAN;

    申请日1997-08-07

  • 分类号H01L29/788;

  • 国家 US

  • 入库时间 2022-08-22 01:37:45

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