首页> 外国专利> Method for making a MOSFET with self-aligned source and drain contacts including forming an oxide liner on the gate, forming nitride spacers on the liner, etching the liner, and forming contacts in the gaps

Method for making a MOSFET with self-aligned source and drain contacts including forming an oxide liner on the gate, forming nitride spacers on the liner, etching the liner, and forming contacts in the gaps

机译:制作具有自对准源极和漏极触点的MOSFET的方法,包括在栅极上形成氧化物衬垫,在衬垫上形成氮化物隔离层,蚀刻衬垫以及在间隙中形成触点

摘要

A method for making a MOSFET in a semiconductor substrate with self aligned source and drain contacts. The method comprises forming a gate oxide layer on the substrate followed by forming a polysilicon gate on the gate oxide layer. A liner oxide layer is formed on the gate and the gate oxide layer and nitride sidewall spacers are formed on the liner oxide layer and adjacent the sidewalls of the gate. A portion of the liner oxide layer and gate oxide layer that lies between the sidewalls of the gate and the nitride sidewall spacers is removed. An oxide layer is then formed around the gate. Next, source and drain regions are formed in the substrate adjacent to the sidewalls of the gate. Finally, a source contact and a drain contact is formed in the area between the gate and the nitride sidewall spacers.
机译:一种在具有自对准源极和漏极触点的半导体衬底中制造MOSFET的方法。该方法包括在衬底上形成栅氧化物层,然后在栅氧化物层上形成多晶硅栅。在栅极上形成衬垫氧化物层,并且在衬垫氧化物层上并且邻近栅极的侧壁形成栅极氧化物层和氮化物侧壁隔离物。去除位于栅极的侧壁与氮化物侧壁间隔物之间​​的衬里氧化物层和栅极氧化物层的一部分。然后在栅极周围形成氧化物层。接下来,在与栅极的侧壁相邻的衬底中形成源极和漏极区域。最后,在栅极和氮化物侧壁间隔物之间​​的区域中形成源极接触和漏极接触。

著录项

  • 公开/公告号US6110790A

    专利类型

  • 公开/公告日2000-08-29

    原文格式PDF

  • 申请/专利号US19990327093

  • 发明设计人 CHIH MING CHEN;

    申请日1999-06-04

  • 分类号H01L21/331;H01L21/8228;

  • 国家 US

  • 入库时间 2022-08-22 01:36:17

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