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Technology for manufacturing and mounting multi-wavelength semiconductor laser array devices (chips) and their application in system architecture

机译:制造和安装多波长半导体激光阵列器件(芯片)的技术及其在系统架构中的应用

摘要

Phase masks which can be used to make both linear and curved gratings of single or multiple submicron pitches, with or without any abrupt quarter-wavelength shifts (or gradually varying finer phase shifts) simultaneously on the wafer/substrate. The phase masks are made using direct write electron or ion-beam lithography of two times the required submicron pitches of linear and curved gratings on commercially available pi phase-shifting material on a quartz substrate and wet or dry etching of the pi phase-shifting material. The phase masks can be used in connection with making multi-wavelength laser diode chips. The laser diodes have a ridge structure with metal shoulders on either side of the ridge. The laser diode chip, with different wavelength lasers, is bonded and interfaced to a novel microwave substrate that allows for high signal-to-noise ratio and low crosstalk. The substrate is packaged in a low loss rugged housing for WDM applications.
机译:相位掩模可用于制作单个或多个亚微米间距的线性和曲面光栅,同时在晶圆/基板上同时具有或不具有任何突然的四分之一波长偏移(或逐渐变化的更精细的相移)。相位掩模是使用直接写入电子或离子束光刻技术制作的,该光刻技术是在石英基板上的市售pi相移材料上线性和弯曲光栅的亚微米间距的两倍所需的微米间距,以及对pi相移材料的湿法或干法蚀刻。相位掩模可以与制造多波长激光二极管芯片结合使用。激光二极管具有脊结构,在脊的任一侧都有金属肩部。具有不同波长激光器的激光二极管芯片被粘结并连接到新型微波基板上,从而实现了高信噪比和低串扰。基板包装在低损耗的坚固外壳中,用于WDM应用。

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