PBGA package and substrate null for PBGA package implementation

摘要

PURPOSE: To prevent imperfect connection between the main body of a PBGA package and a substrate for mounting the PBGA package by making a plurality of openings for exposing solder ball junction positions and setting adequately the thickness of a substrate to be jointed to the junction surface of a solder ball of the main body of the PBGA package. ;CONSTITUTION: A plurality of openings 6a for exposing solder ball jointing place are formed in a substrate 6 adhered to the main body 5 of a solder ball jointing surface of a PBGA package. Inside of this, a solder ball 7 is jointed to the main body 5 of the PBGA package. The plate thickness of the substrate 6 is set in such a manner that its height becomes almost the same as the height of the solder ball 7 which can definitely connect the PBGA package 8 to a PBGA package mounting substrate 9. The PBGA package 8 is arranged to the PBGA package mounting substrate 9, and reflow is applied under pressure. By doing this, the height of the solder balls 7 can be aligned to the height with which the PBGA package 8 can be reliably jointed to the PBGA package mounting substrate 9.;COPYRIGHT: (C)1996,JPO