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The semiconductor equipment null which is produced with minute pattern formation manner, the production manner and the said manner

机译:以微小图案形成方式生产的半导体设备零配件,生产方式以及所述方式

摘要

PROBLEM TO BE SOLVED: To control a minute pattern shape accurately by a simple method by forming the pattern for adjusting the etching speed by controlling the consumption speed of reaction species within a mask pattern in the vicinity of a pattern for obtaining the desired shape. ;SOLUTION: On electronic beam resist, which is applied on an InP substrate, a diffraction grating pattern having the irregular structure is formed in a stripe shaped region by electron-beam exposure, and an etching region I is formed. Furthermore, etching regions II for controlling the etching speed are formed at both sides of the etching region I. When etching is performed by using the mask pattern such as this and using HBr-based enchant, the etching speed is controlled. The etching speed can be made uniform in the pattern of diffraction grating. As a result, the diffraction grating structure having the uniform depth is manufactured. Thus, the minute pattern can be manufactured with excellent uniformity.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:通过简单的方法来精确地控制微小的图案形状,该方法是通过在用于获得所需形状的图案附近的掩模图案内控制反应物种的消耗速度来形成用于调节蚀刻速度的图案。 ;解决方案:在施加于InP基板上的电子束抗蚀剂上,通过电子束曝光在条形区域中形成具有不规则结构的衍射光栅图案,并形成蚀刻区域I。此外,在蚀刻区域I的两侧形成用于控制蚀刻速度的蚀刻区域II。当通过使用诸如此类的掩模图案并使用基于HBr的附魔进行蚀刻时,控制蚀刻速度。可以使衍射光栅的图案中的蚀刻速度均匀。结果,制造了具有均匀深度的衍射光栅结构。因此,可以制造出具有优良均匀性的微小图案。;版权所有:(C)1999,日本特许厅

著录项

  • 公开/公告号JP3152177B2

    专利类型

  • 公开/公告日2001-04-03

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP19970228458

  • 发明设计人 室谷 義治;

    申请日1997-08-25

  • 分类号H01L21/306;H01S5/12;

  • 国家 JP

  • 入库时间 2022-08-22 01:34:56

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