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The formation device and formation manner of the super thin-shaped semiconductor package like TSOP or UTSOP
The formation device and formation manner of the super thin-shaped semiconductor package like TSOP or UTSOP
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机译:TSOP或UTSOP等超薄型半导体封装的形成装置和形成方式
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摘要
An improved mold for forming a semiconductor package and having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.
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