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Organicity contamination detection removal device and its organicity contamination detection removal manner and chemical contamination detection removal device and its chemical contamination detection removal manner

机译:有机污染物检测去除装置及其有机污染物检测去除方式和化学污染物检测去除装置及其化学污染物检测去除方式

摘要

PROBLEM TO BE SOLVED: To provide an organic-contamination detecting and removing device having means, which detects the organic contamination that is the cause of the reduction in the yield rate at manufacturing a highly integrated semiconductor at a high speed, analyzes the material components of this contamination additionally at the same time and removes the contamination, and a device for detecting and removing the chemical contamination and the method for detecting and removing the chemical contamination. ;SOLUTION: These methods include following means in the same device. A pair of oppositely facing trenches are formed on a semiconductor silicon wafer 1 as an object under inspection. An organic-contamination detecting means detects the organic contamination by spectrum analysis from the infrared rays emitted from the end surface of the other facing trench after the infrared rays 2 have been inputted from the end surface of one facing trench and multiply reflected inside the semiconductor silicon wafer 1. An optical dry cleaning mechanism removes the organic contamination, when it is determined that there is organic contamination. The means, wherein whether the organic contamination can be removed or not is checked again through the organic- contamination detecting means, is provided.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:提供一种有机污染物检测和去除装置,该装置具有在高速制造高度集成的半导体时检测导致产率降低的原因的有机污染物的装置,该装置分析了材料的成分。另外,该污染同时去除并去除污染,还包括用于检测和去除化学污染的装置以及用于检测和去除化学污染的方法。 ;解决方案:这些方法在同一设备中包括以下方法。在作为检查对象的半导体硅晶片1上形成有一对相对的沟槽。有机污染物检测装置在从一个相对沟槽的端面输入红外线2并在半导体硅内部多次反射之后,通过从另一相对沟槽的端面发射的红外线通过光谱分析检测有机污染物。晶片1.当确定存在有机污染物时,光学干洗机制可去除有机污染物。提供了一种装置,其中通过有机污染物检测装置再次检查有机污染物是否可以去除。;版权所有:(C)1999,JPO

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