首页> 外国专利> The case alteration the taper process manner and wire diameter of the top and bottom strange form by the wire cutting electrical discharge machine taper process manner null of top and bottom strange

The case alteration the taper process manner and wire diameter of the top and bottom strange form by the wire cutting electrical discharge machine taper process manner null of top and bottom strange

机译:情况由线切割放电机的锥度加工方式和上下奇异线径改变锥度加工方式无效

摘要

PURPOSE: To eliminate interference of a tool in the neighborhood of an internal corner or a concave surface even in case the width of a minute curved surface is made smaller than the radius of a wire by determining the shortages of the tool diameter correcting amount within X-Y plane on the basis of the tapers of two planes. ;CONSTITUTION: The shortages Δr1 and Δr2 of the tool diameter correcting amount (r) within the X-Y plane on the basis of the tapers of the plane H1 and plane H2 are determined from formulae Δr1=r/sin(θ1)-r and Δr2=r/sin(θ2)-r. In the attached figure, L1 represents the straight line tying the dividing point Pm-1 to Pm while L2 does the straight line tying the dividing point Pm to Pm+1, and also L1' represents the straight line generated by parallel movement of straight line L1 for a distance corresponding to the shortage Δr1 of the tool diameter correcting amount within the plane Hu while L2' does the straight line produced by parallel movement of straight line L2 for a distance corresponding to the shortage Δr2 of the tool diameter correcting amount within the plane Hu. The intersection Pu of the two straight lines L1' and L2' is determined, and this is used as the wire correcting position of the dividing point Pu. Therein θ1 represents the angle formed by the plane H1, on which the dividing points Pm, Pm+1, Pn lie, relative to the X-Y plane, while θ2 does the angle formed by the plane H2, on which the dividing points Pm, Pm-1, Pn lie, relative to the X-Y plane.;COPYRIGHT: (C)1995,JPO
机译:目的:通过确定XY内刀具直径校正量的不足,即使在微小的弯曲表面的宽度小于金属丝的半径的情况下,也可以消除刀具在内部拐角或凹面附近的干扰。平面基于两个平面的锥度。 ;组成:XY平面内基于平面锥度的刀具直径校正量(r)的差Δr 1 和Δr 2 H 1 和平面H 2 由公式&r; r 1 = r / sin(θ 1 )-r和Δr 2 = r / sin(θ 2 )-r。在附图中,L 1 表示将分割点Pm -1 与Pm相连的直线,而L 2 则将分割点Pm -1 做成直线。将点Pm划分为Pm +1 ,并且L 1 '表示通过直线L 1 平行移动一定距离而生成的直线对应于平面Hu内刀具直径校正量的短缺量Δr 1 ,而L 2 '做直线L 2 的距离对应于平面Hu内刀具直径校正量的短缺量Δr 2 。确定两条直线L 1 '和L 2 '的交点Pu,并将其用作分割点Pu的导线校正位置。其中& 1 表示由平面H 1 形成的角度,分割点Pm,Pm +1 ,Pn相对到XY平面,而& 2 做由平面H 2 形成的角度,在该角度上分割点Pm,Pm -1 ,Pn相对于XY平面。;版权:(C)1995,JPO

著录项

  • 公开/公告号JP3181434B2

    专利类型

  • 公开/公告日2001-07-03

    原文格式PDF

  • 申请/专利权人 株式会社アマダ;

    申请/专利号JP19930158506

  • 发明设计人 平峰 二郎;

    申请日1993-06-29

  • 分类号B23H7/06;B23H7/02;

  • 国家 JP

  • 入库时间 2022-08-22 01:34:05

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