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Formation manner null of the constituent and the silica glass type inorganic film which include silicone resin

机译:含有硅树脂的成分和二氧化硅玻璃系无机膜的形成方式无效

摘要

PURPOSE:To obtain a silicone resin capable of forming films with good thermal stability under mild conditions when mixed with an acid generator and applied to a base material, consisting of a poly(siloxane) with part of the substituents being butoxyl groups and the rest hydroxyl groups. CONSTITUTION:This silicone resin consists of a poly(siloxane) with all of the substituents being either t-alkoxyl, alpha-substituted aryloxyl, alpha, alpha-disubstituted aryloxyl, (substituted) tetrahydropyranyloxyl, 2-alkoxyethoxyl, 2-aryloxyethoxyl or 2-alkanoyloxyethoxyl groups another version of this silicone resin consists of a poly(siloxane) with part of the substituents being either of the above- mentioned ones and the rest hydroxyl groups. The other objective composition is obtained by incorporating this silicone resin with an acid generator and a boric ester and a phosphoric ester.
机译:用途:获得一种有机硅树脂,该有机硅树脂与酸产生剂混合并涂在基材上时能够在温和的条件下形成具有良好热稳定性的薄膜,该基材由部分取代基为丁氧基和其余羟基的聚硅氧烷组成组。组成:该有机硅树脂由聚(硅氧烷)组成,所有取代基为叔烷氧基,α-取代的芳氧基,α,α-二取代的芳氧基,(取代的)四氢吡喃基氧基,2-烷氧基乙氧基,2-芳氧基乙氧基或2-链烷酰氧基乙氧基基团该硅氧烷树脂的另一种形式是由聚(硅氧烷)组成,其部分取代基为上述取代基中的任何一个,其余为羟基。通过将这种有机硅树脂与酸产生剂和硼酸酯和磷酸酯掺混而获得另一目的组合物。

著录项

  • 公开/公告号JP3193227B2

    专利类型

  • 公开/公告日2001-07-30

    原文格式PDF

  • 申请/专利权人 沖電気工業株式会社;

    申请/专利号JP19940054224

  • 发明设计人 伊東 敏雄;

    申请日1994-03-24

  • 分类号C08G77/14;B05D7/24;C08K5/00;C08K5/521;C08K5/5415;C08K5/55;C08L83/04;C09D183/04;H01L21/027;H01L21/312;H01L23/29;H01L23/31;

  • 国家 JP

  • 入库时间 2022-08-22 01:33:36

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