首页> 外国专利> NiSi TARGET MATERIAL, TARGET, PRODUCING METHOD FOR NiSi TARGET, NiSi THIN FILM, PRODUCING METHOD THEREFOR AND THIN FILM ELEMENT

NiSi TARGET MATERIAL, TARGET, PRODUCING METHOD FOR NiSi TARGET, NiSi THIN FILM, PRODUCING METHOD THEREFOR AND THIN FILM ELEMENT

机译:NiSi靶材,靶材,NiSi靶材的制造方法,NiSi薄膜,其制备方法和薄膜元件

摘要

PROBLEM TO BE SOLVED: To produce a target material in which the amount of catalytic metals to be intruded is controlled, to form a target using the same, to provide a thin film in which the moving degree is high and uniform because the amount of catalytic metals to be intruded is controlled by using the same and to produce a thin film element using the same.;SOLUTION: The target is provided with a target material 11 containing at least one kind among the groups consisting of Ni, Cu, Sn, Ag, Al and Co by 0.01 to 1 atomic %, and the balance substantially Si and a backing plate 12 supporting the target material 11.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:为了制造靶材料,在其中控制要被引入的催化金属的量,使用该靶形成靶,以提供一种移动度高且均匀的薄膜,因为催化量通过使用金属来控制要被侵入的金属,并使用金属来制造薄膜元件。解决方案:靶具有靶材料11,该靶材料11包含Ni,Cu,Sn,Ag中的至少一种; Al和Co以0.01至1原子%的比例存在,其余部分基本上为Si和支撑靶材料11的背板12;版权:(C)2001,JPO

著录项

  • 公开/公告号JP2001220666A

    专利类型

  • 公开/公告日2001-08-14

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP20000024580

  • 发明设计人 HIRAMATSU MASAHITO;KAMIURA NORIHIKO;

    申请日2000-02-02

  • 分类号C23C14/34;B22F3/10;B22F3/17;B22F7/06;C22C1/04;H01L21/20;H01L21/203;H01L29/786;H01L21/336;

  • 国家 JP

  • 入库时间 2022-08-22 01:32:26

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