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LAND-PART FORMATION METHOD OF BURIED SUBSTRATE AND LAND-SHAPE

机译:地下基质与土地形态的土地形成方法

摘要

PROBLEM TO BE SOLVED: To form a land that prevents resin burr and electrode contamination, and eliminates the need for post treatment onto a buried substrate without using any dies.;SOLUTION: Resin 1 is formed onto the front and rear surfaces of a lead frame 2, the resin 1 at a land formation position is eliminated by laser or cutting machining or etching until the resin 1 reaches the lead frame 2, and a lead frame 2 being buried into the resin 1 is exposed, thus forming a land 6.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:形成一个焊盘,以防止树脂毛刺和电极污染,并且无需使用任何裸片就无需对埋入的基板进行后处理。;解决方案:树脂1形成在引线框架的前后表面上参照图2,通过激光或切割加工或蚀刻去除在焊盘形成位置处的树脂1,直到树脂1到达引线框架2,并且将埋入树脂1中的引线框架2暴露出来,从而形成焊盘6。版权:(C)2001,日本特许厅

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