CONNECTOR MATERIAL FOR ELECTRONIC AND ELECTRICAL APPARATUS COMPOSED OF HIGH STRENGTH COPPER ALLOY EXCELLENT IN ROLLABILITY AND BENDING WORKABILITY

摘要

PROBLEM TO BE SOLVED: To produce a lead frame material for a semiconductor system capable of the economical thinning of sheet thickness and strong bending working. ;SOLUTION: This lead frame material for a semiconductor system is composed of a high strength Cu alloy having a composition containing, by weight, 0.07 to 0.4% Cr, 0.01 to 0.15% Zr, 0.01 to 0.4% Ti, 0.01 to 1% Co and/or Fe, 0.002 to 0.4% Al, and the balance Cu with inevitable impurities and excellent in rollability and bending workability.;COPYRIGHT: (C)2001,JPO