ONE SIDE OR BOTH SIDE SEALED SEMICONDUCTOR DEVICE AND METALLIC MOLD FOR TRANSFER MOLD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device for realizing staggered binding of a thin PKG by thickening the resin of the upper face of a chip, and for preventing generation of wire exposure failures by reducing the fluctuation in package thickness by operating resin-sealing by transfer molding using a metallic mold.;SOLUTION: This is a semiconductor assembly constituted of a heat radiating plate attached to the back of the bonding face of a lead frame with a double coated adhesive tape, a single-sided tape attached to the bonding face of the surface of the lead frame, a semiconductor chip fixed to the surface of the heat radiating plate, and a bonding wire for connecting the bonding face of the surface of the lead frame with the semiconductor. Then, the semiconductor chip side face is resin-sealed by transfer mold.;COPYRIGHT: (C)2001,JPO