ORGANIC-LAND GRID ARRAY (OLGA) PACKAGE AND INTEGRATED CIRCUIT PACKAGE CONTAINING OLGA

摘要

PROBLEM TO BE SOLVED: To form a pattern for outgassing holes that reduces impedance variation by design by arranging the apertures in a pair of conductive layers alternately both in a first direction and in a second direction, while arranging a non-conductive layer between the conductive layers to estset almost the same impedance between a pair of metal traces that are located between the pair of conductive layers.;SOLUTION: An OLGA(organic-land grid array) having a pair of conductive layers constituted by metal layers 302 and 304, which sandwich a dielectric layer 306, is provided. The metal layers 302 and 304 have a plurality of apertures or outgassing holes 308 and 310, respectively. The metal layers 302 and 304 are stacked in vertical direction, wherein outgassing holes 308 in the layer 302 and outgassing holes 310 in the layer 304 are arranged alternately both in X direction and in Y direction. Metal traces 312 and 314, which serve as signal traces, are arranged between the metal layers 302 and 304 to establish almost same impedance.;COPYRIGHT: (C)2001,JPO