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FORMING METHOD FOR ELECTRODEPOSITION COATING FILM, CATIONIC ELECTRODEPOSITION COATING COMPOSITION, AND ELECTRODEPOSITION COATED ARTICLE
FORMING METHOD FOR ELECTRODEPOSITION COATING FILM, CATIONIC ELECTRODEPOSITION COATING COMPOSITION, AND ELECTRODEPOSITION COATED ARTICLE
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机译:电沉积膜,阳离子电沉积膜组合物和电沉积涂层制品的形成方法
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摘要
PROBLEM TO BE SOLVED: To form a coating film which prevents the occurrence of gas pinholes on a steel sheet, especially on a zincified steel sheet or a galvanized steel sheet, and exhibits a high throwing power by specifying the lowest film-forming temperature and electrical conductivity during coating of a cationic electrodeposition coating material. SOLUTION: Electrodeposition coating is conducted at a set electrodeposition coating temperature and by using a cationic electrodeposition coating material of which the lowest film-forming temperature is adjusted to in the range of ±5 deg.C of the set electrodeposition coating temperature (preferably from -2 to 0 deg.C) and of which the electrical conductivity during coating is adjusted to 1,000-1,500 μS/cm. The lowest film-forming temperature is adjusted to in the range of ±5 deg.C of the set electrodeposition coating temperature e.g. by increasing the mol.wt. of a cationic substrate resin contained in the coating material, The electrical conductivity during coating is adjusted to 1,000-1,500 μS/cm e.g. by partially reacting epoxy terminals with an alkylphenol or a carboxylic acid and cationizing with an amine to decrease the amount of cationization of the cationic substrate resin. The cationic electrodeposition coating material contains the cationic substrate resin, a curing agent, and an organic solvent.
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机译:解决的问题:形成能够防止在钢板上,特别是在镀锌钢板或镀锌钢板上产生气孔的涂膜,并通过指定最低的成膜温度和电性能表现出高的投射力。阳离子电沉积涂料涂覆过程中的电导率。解决方案:电沉积涂覆是在设定的电沉积涂覆温度下进行的,并且使用阳离子电沉积涂覆材料,将其最低成膜温度调节到设定电沉积涂覆温度的±5℃范围内(最好从-2至0℃),并且将涂布过程中的电导率调整为1,000-1,500μS/ cm。将最低成膜温度调节到设定的电沉积涂层温度例如5℃至+ 5℃的范围内。通过增加分子量。涂料中所含的阳离子底物树脂的重量百分比被调整为1000-1500μS/ cm 2。通过使环氧末端与烷基酚或羧酸部分反应,并与胺阳离子化以减少阳离子底物树脂的阳离子化量。阳离子电沉积涂料包含阳离子基质树脂,固化剂和有机溶剂。
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