METHOD AND DEVICE FOR IMPROVING COVERAGE OF SIDE WALL AND BOTTOM FACE IN IMP TREATMENT BY USING MAGNETIC FIELD

摘要

PROBLEM TO BE SOLVED: To provide a method for providing an excellent isometric coverage on the structural part of a device, particularly, on the side wall. ;SOLUTION: This invention provides a method and device for realizing an isometric step coverage in a deposition treatment. At least in one mode, a target 104 provides a source of the material sputtered by plasma and subsequently ionized by an induction coil 122. A part of electrons provided by plasma and ionized target material is deflected by the magnetic field 161 generated in the vicinity of a substrate 110. By the influence of the induced electrons, the positively charged particles are induced so as to move in the direction of the electrons. The magnetic field 161 can be provided by one or more magnets 160 located at the inside or outside of a treating chamber 100 and can be rotated for securing the uniform deposition of the electrons and ions at the structural part of the device.;COPYRIGHT: (C)2001,JPO