SEMICONDUCTOR DEVICE PACKAGE WITH FOOTPRINT ALMOST SAME SIZE AS SEMICONDUCTOR DIE, AND MANUFACTURING PROCESS THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a simple and low-cost manufacturing process by extending a wrap-around layer around the edge of die, and forming a partial electric connection between a position in front of the die and a terminal on the rear side of it before a wafer is cut into individual dies. ;SOLUTION: On a die strip 214, a wrap around conductive polymer layer or a metal layer similar to a layer 215 in function is formed. After a wafer 200 is split into dice 206, a conductive wrap around layer is formed which connects the front side of a die 206A to a device terminal on the rear side of it. The wrap around layer is extended around the edge of the die 206A and the wafer 200 is cut into individual dice 206. Thus, a surface-mounting semiconductor device package with a footprint of the same size as the die 206A is manufactured at a lower cost.;COPYRIGHT: (C)2001,JPO