首页> 外国专利> SEMICONDUCTOR INTEGRATED CIRCUIT FOR SPECIFIC APPLICATION, METHOD FOR DESIGNING IT, AND CIRCUIT BLOCK LIBRARY FOR DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT FOR SPECIFIC APPLICATION

SEMICONDUCTOR INTEGRATED CIRCUIT FOR SPECIFIC APPLICATION, METHOD FOR DESIGNING IT, AND CIRCUIT BLOCK LIBRARY FOR DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT FOR SPECIFIC APPLICATION

机译:特定应用的半导体集成电路,其设计方法以及用于特定应用的半导体集成电路的电路块库

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit for specific application that is small and has a high performance by making use of the advantage of a laminated package, to provide a method for designing such semiconductor integrated circuit at low cost in a short period, and to provide a circuit block library for designing such semiconductor integrated circuit.;SOLUTION: Using a library including information about the general circuit block composed of a general element and a general element connection block, by taking advantage of the information about electrical characteristics of the general element included in this library, a first semiconductor integrated circuit chip including a circuit for specific application wherein the general element connection block is arranged is designed after its operation simulation. This first semiconductor integrated circuit and a second semiconductor integrated circuit mounted with the general-purpose element included in the library are mutually connected and stored in a common package. As a result, the problems are solved.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:通过利用层叠封装的优点,提供一种小型且具有高性能的用于特定用途的半导体集成电路,提供一种在短时间内以低成本设计这种半导体集成电路的方法。解决方案:利用一个库,该库包含有关由通用元件和通用元件连接块组成的通用电路块的信息,并利用有关该器件的电特性的信息。作为该库中包括的通用元件,在其操作仿真之后设计包括用于特定应用的电路的第一半导体集成电路芯片,其中布置通用元件连接块。安装有库中包括的通用元件的该第一半导体集成电路和第二半导体集成电路相互连接并存储在公共封装中。结果,解决了这些问题。;版权所有:(C)2001,日本特许厅

著录项

  • 公开/公告号JP2001308259A

    专利类型

  • 公开/公告日2001-11-02

    原文格式PDF

  • 申请/专利权人 KAWASAKI STEEL CORP;

    申请/专利号JP20000117625

  • 发明设计人 YAMAMOTO HIROSHI;

    申请日2000-04-19

  • 分类号H01L25/065;H01L25/07;H01L25/18;G06F17/50;H01L21/82;H01L27/10;

  • 国家 JP

  • 入库时间 2022-08-22 01:29:47

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