首页> 外国专利> SILICONE-CONTAINING POLYIMIDE RESIN, SILICONE-CONTAINING POLYAMIC ACID AND THEIR PRODUCTION

SILICONE-CONTAINING POLYIMIDE RESIN, SILICONE-CONTAINING POLYAMIC ACID AND THEIR PRODUCTION

机译:含硅酮的聚酰亚胺树脂,含硅酮的聚丙烯酸及其生产

摘要

PROBLEM TO BE SOLVED: To obtain the subject resin capable of exhibiting excellent heat resistance and flexibility by subjecting an organosiloxane having a specific chemical structure to copolymerization. SOLUTION: This silicone-containing polyimide resin comprises 0.1-100 mol% of structural units expressed by formula I [Ar1 is a tetravalent organic residue having at least one aromatic ring; R is a monovalent hydrocarbon residue not containing any aliphatic unsaturated bond; X is an alkylene having two or more carbon atoms or the like; (m) and (n) are each 0 or 1-3, provided that (m)+(n) is 1-6] and 99.9-0 mol% of structural units of formula II [Ar2 is a tetravalent organic residue having at least one aromatic ring; Ar3 is a divalent organic residue having at least one aromatic ring]. The resin can be obtained by subjecting a silicone-containing polyamic acid comprising 0.1-100 mol% of structural units of formula III (Z is H or the like) and 99.9-0 mol% of structural units of formula IV to thermal cyclodehydration to imidate. Thus the objective resin excellent in both heat resistance and flexibility can be provided.
机译:解决的问题:通过使具有特定化学结构的有机硅氧烷进行共聚,以获得能够显示优异的耐热性和柔韧性的主题树脂。 SOLUTION:这种含硅氧烷的聚酰亚胺树脂包含0.1-100 mol%的式I表示的结构单元[Ar1是具有至少一个芳香环的四价有机残基; R是不含任何​​脂族不饱和键的一价烃基; X是碳数为2以上的亚烷基。 (m)和(n)各自为0或1-3,只要(m)+(n)为1-6]且99.9-0mol%的式II的结构单元[Ar 2为具有至少一个芳香环; Ar 3为具有至少一个芳香环的二价有机残基。可以通过使包含0.1-100mol%的式III的结构单元(Z为H等)和99.9-0mol%的式IV的结构单元的含硅酮的聚酰胺酸热环脱水成亚氨酸来获得。 。因此,可以提供耐热性和挠性均优异的目标树脂。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号