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Silicone-containing polyimide resin and silicone-containing polyamic acid

机译:含硅的聚酰亚胺树脂和含硅的聚酰胺酸

摘要

PROBLEM TO BE SOLVED: To obtain the subject resin exhibiting excellent water repellency, adhesivity, solvent solubility, flexibility and molding processability, and useful for coating agents, films and adhesives, by copolymerizing a specific polyorganosiloxane. ;SOLUTION: This silicone-contg. polyimide resin is composed of (A) 0.1-100 mol.% of structural unit of formula I [Ar1 is an aromatic ring-bearing organic tetravalent group; R is a monovalent hydrocarbon group free from aliphatic unsaturated bond; X is a ≥2C (alkyleneoxy)alkylene; Y is X or O; (l), (m) and (n) are each 1-10; (p) is 1-80; (a) is 0 or 1] and (B) 99.9-0 mol.% of structural unit of formula II (Ar2 is the same as Ar1; Ar3 is an aromatic ring-bearing organic bivalent group). This polyimide resin is obtained, for example, by copolymerization between the corresponding tetracarboxylic acid dianhydride, a compound of formula III (Z is H or a group of the formula: SiR3) and a compound of the formula: H2N-Ar5-NH2 (Ar5 is the same as Ar3) at specified proportions to form a silicone-contg. polyamic acid which, in turn, is imidated.;COPYRIGHT: (C)1999,JPO
机译:要解决的问题:通过使特定的聚有机硅氧烷共聚,获得具有优异的拒水性,粘合性,溶剂溶解性,柔韧性和模塑加工性的主题树脂,并用于涂料,薄膜和粘合剂。 ;解决方案:此有机硅控制。聚酰亚胺树脂由(A)0.1〜100摩尔%的式I的结构单元[Ar 1 是具有芳香环的有机四价基团构成。 R是不含脂族不饱和键的一价烃基; X是&ge; 2 C(亚烷氧基)亚烷基; Y是X或O; (l),(m)和(n)分别为1-10; (p)是1-80; (a)为0或1]和(B)99.9-0 mol%的式II结构单元(Ar 2 与Ar 1 相同; Ar < Sup> 3 是带有芳香环的有机二价基团。该聚酰亚胺树脂例如通过使相应的四羧酸二酐,式III的化合物(Z为H或式SiR 3 的基团)与式III的化合物共聚而获得。 :H 2 N-Ar 5 -NH 2 (Ar 5 与Ar 3相同)以指定比例形成有机硅接触物。聚酰胺酸,又被酰亚胺化。;版权所有:(C)1999,日本特许厅

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