COPPER FOIL FOR PRINTED-WIRING BOARD, METAL FOIL WITH CAREER FOIL, AND SEMI-ADDITIVE PROCESS OF PRINTED-WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a coper foil and an etching procedure for solving the problem where not only the copper foil layer but also the surface of a plating copper layer is etched during a final flash etching step and circuit edge is corroded in a conventional semi-additive process.;SOLUTION: A copper foil and a metallic foil with a carrier foil, capable of forming a nickel layer or a tin layer of 0.5-3 μm thickness on the external surface layer of a copper-clad laminated board are used in a semi-additive process. Then, a plating resist layer is formed on the nickel layer or on the tin layer. A circuit formation pattern is exposed and developed on the plating resist layer, so that the plating resist layer in a circuit formation part is removed and only the plating resist layer in a non-circuit formation part is left. In a step for forming a pattern copper layer, the plating copper layer is formed on the nickel layer or the tin layer of the circuit formation part, and the plating resist layer in the non-circuit formation part is removed. Only the nickel layer or the tin layer in the non-circuit formation part is removed, by using flash etching with a selective etching solution that does not dissolve the copper layer.;COPYRIGHT: (C)2001,JPO