首页> 外国专利> METHOD FOR ASSEMBLING/ADJUSTING OPTICAL PART FOR OPTICAL PICKUP DEVICE, METHOD FOR ASSEMBLING/ADJUSTING OPTICAL PART FOR LASER UNIT, DEVICE FOR DETECTING POSITIONAL DEVIATION OF OPTICAL PART AND DEVICE FOR ASSEMBLING OPTICAL PART

METHOD FOR ASSEMBLING/ADJUSTING OPTICAL PART FOR OPTICAL PICKUP DEVICE, METHOD FOR ASSEMBLING/ADJUSTING OPTICAL PART FOR LASER UNIT, DEVICE FOR DETECTING POSITIONAL DEVIATION OF OPTICAL PART AND DEVICE FOR ASSEMBLING OPTICAL PART

机译:光学拾取装置的光学部件的组装/调整方法,激光装置的光学部件的组装/调整方法,光学部件的位置偏差检测装置以及光学部件的组装装置

摘要

PROBLEM TO BE SOLVED: To position and mount with high precision and in a short time the relative position between the light emitting point of a semiconductor laser and the light receiving part of a light receiving element and further the position of optical parts such as a grating or a hologram.;SOLUTION: The position of the light emitting point (chip surface active layer) of the semiconductor laser 21 is detected by an adjusting optical system consisting of a microscope 32 and a CCD camera 33 through a polarizing beam splitter 22, and a deviation from a prescribed position is calculated to perform the translational adjustment (positional adjustment in X and Y directions) for the semiconductor laser 21. That is, the semiconductor laser 21 is moved by using an exclusive arm by the positional moving quantity of the semiconductor laser 21 calculated from the position of the light emitting point detected by image processing image pickup data by the CCD camera 33. The semiconductor laser 21 is fixed to a substrate by adhering or soldering after the positional adjustment.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:在短时间内高精度定位和安装半导体激光器的发光点和光接收元件的光接收部分之间的相对位置,以及光学部件(例如光栅)的位置解决方案:半导体激光器21的发光点(芯片表面活性层)的位置通过由偏光分束器22组成的显微镜32和CCD照相机33组成的调节光学系统检测,并且计算与规定位置的偏差,以进行半导体激光器21的平移调整(X,Y方向的位置调整)。即,利用排他臂使半导体激光器21移动半导体的位置移动量。根据通过CCD相机33对图像拾取图像数据进行图像处理而检测到的发光点的位置计算出的激光21。半导体激光器21位置调整后,通过粘接或焊接将其固定在基板上。版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001216659A

    专利类型

  • 公开/公告日2001-08-10

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP20000025826

  • 发明设计人 HIRAI HIDEAKI;

    申请日2000-02-03

  • 分类号G11B7/08;G02B7/00;G11B7/22;

  • 国家 JP

  • 入库时间 2022-08-22 01:27:33

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