ELECTROLESS NICKEL PLATING BATH COMPOSITION AND PLATING FORMED BODY HAVING ELECTROLESS NICKEL FILM FORMED BY USING IT

摘要

PROBLEM TO BE SOLVED: To improve the adhesive strength between a glass substrate or a ceramic substrate and an Ni film by incorporating one or more kinds selected from Bi and Te as an essential additive. ;SOLUTION: In the case an electroless Ni plating bath compsn. is incorporated with Bi, ordinarily, it is charged in the form of bismuth nitrate, bismuth sulfate or the like. The amt. of Bi incorporated into the compsn. is preferably controlled to ≥0.01 mg/l expressed in terms of the Bi content. Moreover, in the case the compsn. is incorporated with Te, ordinarily, it is charged in the form of telluric acid, tellurium chloride or the like. The amt. of Te incorporated into the compsn. is preferably controlled to ≥0.01 mg/l expressed in terms of the Te content. Furthermore, the pH of the plating bath is suitably controlled to 3 to 12. For forming an Ni film, the body to be plated is dipped into a catalytic soln. contg. a Pd catalyst in advance, and Pd is adhered on the surface of the body to be plated. Next, the body to be plated is dipped into the Ni plating bath, and Ni is precipitated into the surface of the body to be plated.;COPYRIGHT: (C)2000,JPO