PROBLEM TO BE SOLVED: To obtain a UV-curing resin composition excellent in developability, resolution, development latitude and resistance to the heat of soldering and capable of preparing a photo-soldering resist ink developable with a dilute aqueous alkali solution and capable of forming a soldering resist which exhibits excellent adhesion to a substrate, excellent electric corrosion resistance and particularly excellent resistance to the heat of soldering and to gold plating on the substrate. SOLUTION: The UV-curing resin composition contains (A) a UV-curing resin obtained by allowing a copolymer formed by polymerizing ethylenically unsaturated monomer components including an ethylenically unsaturated monomer (a) having an epoxy group and a compound (b) having two or more ethylenically unsaturated groups in one molecule to react with an ethylenically unsaturated monomer (d) having a carboxyl group and to react further with a saturated or unsaturated polybasic acid anhydride (e), (B) an epoxy compound having two or more epoxy groups in one molecule, (C) a photopolymerization initiator and (D) a diluent.
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