METHOD FOR REPAIRING CSP/BGA

摘要

PROBLEM TO BE SOLVED: To provide a method by which no unsoldered part is produced during remounting CSP/BGA.;SOLUTION: This method includes a step (d) for supplying a highly active flux 5 to the inside of a dam block 4 and heating it with a heater 6 provided under a wiring board 1; a step (e) for removing the dam block 4, cleaning and removing the remaining flux 5, applying a low active flux to the area of the wiring board 1 where a BGA (or CSP) is remounted, and remounting a non- defective BGA (or CSP) 2b; and a step (f) for bonding the wiring board 1 and non-defective BGA (or CSP) 2b by reflow.;COPYRIGHT: (C)2001,JPO