MANUFACTURE OF FILM CARRIER TAPE FOR ELECTRONIC COMPONENT MOUNTING AND WARPAGE REDUCTION DEVICE OF THE TAPE

摘要

PROBLEM TO BE SOLVED: To reduce warpage of a film carrier tape by bringing a film carrier tape into contact with a heating roll shape capable of giving reverse wapage and, by quenching it thereafter. ;SOLUTION: A film carrier tape 1 provided with a solder resist layer as a wiring circuit pattern and a protection insulating layer is fed to a base film tape formed by sticking an adhesive layer to an insulation film, such as a polyimide film at a prescribed velocity from a reel fixed to a feed device 2. The fed film carrier tape 1 is brought into contact with a heating roll 3 shaped capable of giving reverse warpage. It is quenched from this state and is contracted again, and the film carrier tape 1 is made flat. Thereby, warpage of the film carrier tape 1 can be reduced rapidly.;COPYRIGHT: (C)2000,JPO