Copper poly-I microalloyed high electrical and thermal conductivity and propiedads superior to conventional copper based alloys the mechanical.

摘要

Copper poly-microalloyed high electrical conductivity and thermal and mechanical properties superior to those of conventional copper base alloys. Copper poly-microalloyed of the invention is applicable as base metal for electrical circuits, which greatly improves the important physical characteristics of said metallic base, and having a superior high electrical conductivity and thermal and mechanical properties to the copper-based alloys used conventionally. For that, the poly-microalloyed copper is a poly-microalloying copper-based high purity comprising multiple alloying metals; preferably Pb, Sn, Ag, Ni, Sb, Fe and Zn, at concentrations between 20 and 500 grams per ton of alloy, depending on the metal.