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Manufacturing electronic components in a direct-write process using precision spraying and laser irradiation
Manufacturing electronic components in a direct-write process using precision spraying and laser irradiation
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机译:使用精密喷涂和激光辐照以直接写入工艺制造电子元件
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摘要
This invention combines the precision spray process with in-flight laser treatment in order to produce direct write electronic components. In addition to these components, the process can lay down lines of conductive, inductive, and resistive materials. This development has the potential to change the approach to electronics packaging. This process is revolutionary in that components can be directly produced on small structures, thus removing the need for printed circuit boards.
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