DIFFUSION BARRIER AND ADHESIVE FOR PARMOD APPLICATION TO RIGI D PRINTED WIRING BOARDS

摘要

PARMODTM materials comprised of a metal powder or metal powder mixture of specified characteristics and a Reactive Organic Medium, are easily printed or deposited on electronic components, such as a Printed Wiring Board substrate, and cured at low temperatures to form a highly conductive, well bonded, well consolidated pure metal component. The adhesion of PARMODTM conductors on an electronic component is enhanced by printing the PARMODTM on a polyimide coating which has been applied to the electronic component.