Method of soldering a copper wire to a silver contact on a silicon photovoltaic cell and application of said method to a plurality of silicon photovoltaic cells

摘要

Photovoltaic cells with silver-rich thick film electrical contacts and superior thermal aging properties are disclosed. Electrical wires are bonded to the silver-rich thick film contacts using a tin and silver solder paste comprising between about 96% tin/4% silver and 98% tin/2% silver. Solar cells having soldered connections incorporating the present invention exhibit the capabilty of withstanding temperatures in the range of 150 DEG C. with little or no deterioration of the solder bonds for periods far longer than conventionally prepared cells.