VERFAHREN UND BESCHLCHTUNGSMASSE FUR DIE APPLIKATION VON HEATSINKPASTE AUF LEITERPLATTEN

摘要

PURPOSE: A process and a coating composition for applying a heat-sink paste to circuit boards are provided to improve characteristic numbers and physical, mechanical and electrical properties of circuit boards. CONSTITUTION: The coating composition(10) has at least 0.5W/mK of thermal conductivity, when hardened. And, it has at least 10Pas of dynamic viscosity, before being hardened. This coating composition(10) is used to apply heat-sink paste on printed circuit boards. This nonmetal coating composition(10) is used on the surface of an insulation plate(6) and/or more than one borings of the insulation plate(6). A conductor is placed on the insulation plate(6) to connect electrical components. A boring and/or a landing/flange area may be positioned on the insulation plate(6), and the insulation plate(6) can be coated with metal film for thermal radiation.