首页> 外国专利> METHOD FOR FORMING GATE ELECTRODE OF MULTILAYER TUNGSTEN POLYCIDE STRUCTURE OF SEMICONDUCTOR DEVICE

METHOD FOR FORMING GATE ELECTRODE OF MULTILAYER TUNGSTEN POLYCIDE STRUCTURE OF SEMICONDUCTOR DEVICE

机译:半导体器件多层钨多晶结构栅电极的形成方法

摘要

A kind of purpose: method, the gate electrode for being used to form a multilayer tungsten polycide structure of semiconductor device is arranged to prevent the degeneration of a gate electrode characteristic and realizes a stable electrical characteristics of a lower resistance, by alternately executing two tungsten-silicide process, SiH4 the and SiH2Cl2 gases on a kind of top of polysilicon layer are used. Construction: in the method for forming a gate electrode (G), a gate insulating layer and a doped polysilicon (16) are sequentially formed on semi-conductive substrate (10), the one tungsten-polycide structure with semiconductor device. First tungsten silicide layer (18) as SiH2Cl2 and WF6 by using a kind of idle source gas to be formed in doped polysilicon layer. Undoped polysilicon layer (20) is formed in the first tungsten silicide layer. Second tungsten silicide layer (22) as SiH3 and WF6 by using a kind of idle source gas to be formed in undoped polysilicon layer. One gate electrode of form is patterned to using a gate mask, the second tungsten silicide layer, undoped polysilicon layer, the first tungsten silicide layer and doped polysilicon layer by a photolithography process.
机译:一种目的:通过交替地执行两个钨来布置用于形成半导体器件的多层钨多晶硅化物结构的栅电极,以防止栅电极特性的退化并实现较低电阻的稳定电特性。 -硅化物工艺中,使用了在一种多晶硅层顶部上的SiH4和SiH2Cl2气体。构造:在形成栅电极(G)的方法中,在半导体衬底的一种钨-多晶化物结构中,在半导体衬底(10)上依次形成栅绝缘层和掺杂的多晶硅(16)。通过使用一种将在掺杂的多晶硅层中形成的惰性源气体,第一硅化钨层(18)为SiH 2 Cl 2和WF 6。在第一硅化钨层中形成未掺杂的多晶硅层(20)。通过使用一种待在未掺杂的多晶硅层中形成的惰性源气体,第二硅化钨层(22)为SiH3和WF6。通过光刻工艺使用栅极掩模,第二硅化钨层,未掺杂的多晶硅层,第一硅化钨层和掺杂的多晶硅层将一个形式的栅电极图案化。

著录项

  • 公开/公告号KR20010008609A

    专利类型

  • 公开/公告日2001-02-05

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR19990026528

  • 发明设计人 EUN YONG SEOK;LEE U YEONG;

    申请日1999-07-02

  • 分类号H01L21/336;

  • 国家 KR

  • 入库时间 2022-08-22 01:14:17

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