首页> 外国专利> METHOD FOR MANUFACTURING THICK MOTHER-OF-PEARL SHEET USING CHIPS OF THIN MOTHER-OF-PEARL SHEET THICK MOTHER-OF-PEARL SHEET MADE FROM THE SAME METHOD AND STRINGED INSTRUMENTS USING ORNAMENTAL WORKPIECE MADE FROM THE THICK MOTHER-OF-PEARL SHEET

METHOD FOR MANUFACTURING THICK MOTHER-OF-PEARL SHEET USING CHIPS OF THIN MOTHER-OF-PEARL SHEET THICK MOTHER-OF-PEARL SHEET MADE FROM THE SAME METHOD AND STRINGED INSTRUMENTS USING ORNAMENTAL WORKPIECE MADE FROM THE THICK MOTHER-OF-PEARL SHEET

机译:使用相同的方法制造的薄薄的珍珠贝母片的芯片制造厚的珍珠母板的方法,以及使用由厚实的珍珠母贝片制成的装饰性工装,拉伸弦乐器

摘要

PURPOSE: A thick plate mother-of-pearl sheet is provided which is economical by using fragments of a thin plate mother-of-pearl sheet, thereby obtaining sufficiently valuable patterns of mother-of-pearl, and has superior machinability of the cutting surface during laser cutting by using a laser-cutter. CONSTITUTION: The thick plate mother-of-pearl sheet (10) manufactured using thin plate mother-of-pearl sheet chips (10a) comprises a transparent plate (10b) material of synthetic resin having a thickness of 0.5 to 3 mm; a transparent adhesive (10c) coated on the plate; and thin plate mother-of-pearl sheet chips adhered on all over the surface of the plate by the adhesive, wherein the thick plate mother-of-pearl sheet further comprises a surface protective film of transparent synthetic resin material on the surface of the thin plate mother-of-pearl sheet chips (10a). The stringed musical instrument is inlaid with decorative patterns obtained by cutting the thick plate mother-of-pearl sheet using thin plate mother-of-pearl sheet chips into a certain shape as a position mark of a finger fingerboard, wherein the thin plate mother-of-pearl sheet chips comprise a transparent plate of synthetic resin material, a transparent adhesive material coated on the plate, and thin plate mother-of-pearl sheet chips adhered on all over the surface of the plate by the adhesive. The method for manufacturing the thick plate mother-of-pearl sheet using the thin plate mother-of-pearl sheet chips comprises a first process of coating transparent liquid phase epoxy, transparent liquid phase acrylic or transparent liquid phase formica as an adhesive on a transparent epoxy plate, transparent acrylic plate or transparent formica plate; and a second process of adhering thin plate mother-of-pearl sheet chips on the adhesive.
机译:目的:提供一种厚板的珍珠母片,其通过使用薄板的珍珠母片的碎片是经济的,从而获得足够有价值的珍珠母图案,并且具有优异的切削表面可加工性在使用激光切割机进行激光切割时。组成:使用薄板珍珠贝母片芯片(10a)制造的厚板珍珠贝母片(10)包括厚度为0.5至3毫米的合成树脂制成的透明板(10b);涂在板上的透明粘合剂(10c);薄板珍珠母片芯片通过粘合剂粘附在板的整个表面上,其中厚板珍珠母片还包括在薄板表面上的透明合成树脂材料的表面保护膜。板状珍珠母片芯片(10a)。弦乐器上镶嵌有装饰图案,该装饰图案是通过使用薄板的珍珠母片芯片将厚板的珍珠母片切割成一定形状作为手指指板的位置标记而获得的,其中,薄板母...珍珠贝片状芯片包括合成树脂材料的透明板,涂覆在该板上的透明粘合剂材料,以及通过粘合剂粘附在板的整个表面上的薄板珍珠贝片状芯片。使用薄板珍珠母片芯片制造厚板珍珠贝母片的方法包括将透明液相环氧树脂,透明液相丙烯酸或透明液相胶木作为粘合剂涂覆在透明材料上的第一步骤。环氧板,透明丙烯酸板或透明福米卡板;第二步是将薄板珍珠贝母片芯片粘附在粘合剂上。

著录项

  • 公开/公告号KR20010086934A

    专利类型

  • 公开/公告日2001-09-15

    原文格式PDF

  • 申请/专利权人 YANG YONG JIN;

    申请/专利号KR20000010936

  • 发明设计人 YANG YONG JIN;

    申请日2000-03-04

  • 分类号B44C3/00;

  • 国家 KR

  • 入库时间 2022-08-22 01:12:53

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