A multilayer wiring board, a pre-fabric material of a multilayer wiring board, a method of manufacturing a multilayer wiring board, an electronic part, an electronic part package, and a method of forming an electrically conductive filler

摘要

The present invention relates to a multilayer wiring board using an electrically conductive filler for interlaminar connection of a wiring layer. A through hole is formed in the via land of the wiring layer of the multilayer wiring board so that stress applied between the conductive filler and the wiring layer can be released at the time of connecting the via filler formed in the wiring layer and the conductive filler. Since the contact portion between the conductive filler and the via land has a shape in which the outer surface of the conductive filler and the surface of the via land are smoothly continuous, the notch effect can be alleviated. Therefore, the connection reliability can be ensured even when stress is applied to the interlayer connection portions in the manufacturing process of the multilayer wiring board, the mounting process of the electronic components, and the like.