Soldering reliability accelerated life test apparatus and test method of the disclosed electronic device is to check the soldering reliability of the solder joint which generates a heavy load and high heat by thermal shock test that gives a sudden change in temperature and volume after the electronic product itself upside down will be.;The present invention is a test product installed upside down in the test apparatus, a control unit for controlling the temperature and time of the cold air and hot air to supply cold air and hot air according to the accelerated life test mode, and a signal transmitter for driving the test product , A power supply for supplying power to the signal transmitter, an acoustic generator for generating sound according to the acoustic generation test mode, and a timer for receiving the acceleration life test mode on-off signal from the time signal of the controller and outputting the signal to the acoustic generator. It is composed.;Therefore, by installing the product upside down at the time of testing, it is possible to check the weight load and crack state of the solder joint, to give a sudden change in temperature and volume, to maximize the vibration generated inside the product, and to increase the test temperature further than before. By increasing the test time of each step, not only can the test conditions be more severe than the actual product problems, but also the product quality can be improved; Accelerated life test is performed while the product is running, so if there is any problem, it is possible to know immediately how many cycles of failures and problems occurred. Therefore, the development period can be shortened.
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