Process for the current-less deposition of metallic layers e.g., silver on a substrate comprises producing a closed layer on the substrate, removing the solvent and contacting the layer with a solution containing the metal to be deposited

摘要

Process for the current-less deposition of metallic layers on a substrate comprises producing a closed layer on the substrate surface by applying a modified or non-modified slip containing an inorganic binder, a reductant and a solvent; removing the solvent from the layer; and contacting the layer with a solution containing the metal to be deposited in the form of ions.