首页> 外国专利> Metal oxide semiconductor transistor comprises a sink doped with a first conductivity type in semiconductor substrate, an epitaxial layer and source/drain regions of a second conductivity type and channel region arranged in epitaxial layer

Metal oxide semiconductor transistor comprises a sink doped with a first conductivity type in semiconductor substrate, an epitaxial layer and source/drain regions of a second conductivity type and channel region arranged in epitaxial layer

机译:金属氧化物半导体晶体管包括在半导体衬底中掺杂有第一导电类型的阱,外延层,以及第二导电类型的源/漏区和布置在外延层中的沟道区

摘要

Metal oxide semiconductor transistor comprises: sink doped with a first conductivity type in semiconductor substrate; epitaxial layer arranged in sink surface and having doping concentration of less than 1017 cm-3; and source/drain regions of second conductivity type and a channel region arranged in epitaxial layer. Depth of source/drain regions is less than or equal to epitaxial layer thickness. An Independent claim is also included for a process for the production of the metal oxide semiconductor (MOS) transistor comprising: producing a sink doped with a first conductivity type in the semiconductor substrate; growing an epitaxial layer on the surface of the sink; producing a gate dielectric on the surface of the epitaxial layer; forming a gate electrode on the surface of the gate dielectric; and producing source/drain regions doped with second conductivity type in the epitaxial layer.
机译:金属氧化物半导体晶体管包括:在半导体衬底中掺杂有第一导电类型的阱;外延层布置在凹陷表面中并且掺杂浓度小于10 17 cm -3;第二导电类型的源/漏区和布置在外延层中的沟道区。源极/漏极区域的深度小于或等于外延层的厚度。还包括用于制造金属氧化物半导体(MOS)晶体管的方法的独立权利要求,该方法包括:在半导体衬底中产生掺杂有第一导电类型的阱;在水槽的表面上生长外延层;在外延层的表面上产生栅极电介质;在栅极电介质的表面上形成栅电极;在所述外延层中产生掺杂有第二导电类型的源/漏区。

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