A method for the production of surfaces micro mechanical structures by etching with a vapour, etching medium containing hydrofluoric acid

摘要

A process for the production of surfaces micro mechanical structures is proposed, in which case, first on a heatable substrate (25), a sacrificial layer (2) is deposited, the at least largely or in some regions, is composed of silicon dioxide, and then, on the sacrificial layer (2) a second layer (3) is deposited and structured. Then, the sacrificial layer (2) in an etching process by means of a vaporous, flow acid hold strength etching medium (24) is removed, as a result of which the surface micromechanical structures (9) are formed. Furthermore, with the progressive removal of the sacrificial layer (2) a controlled change in the relative humidity in the etching medium (24) is carried out.