Electrical and electronic components assembly method e.g. for mobile communications engineering, involves use of cut-outs in electrical circuit board in order to provide additional space for installation of additional electrical components

摘要

Manufacture of large numbers of electrical and electronic components e.g. for the mobile communications industry involves the semiconductor chip in large numbers in order to achieve the required high packing densities, but suffers from the disadvantage of a only being worthwhile for large production runs. To overcome this problem, cut-outs (5) are now used in the electrical circuit board so as to free-up extra space and to provide locations for the assembly of additional electrical components, with the additional components assembled in the same working step, e.g. by reflow soldering, as the other electrical components positioned over them.