Forming thin coating for manufacturing semiconducting components involves applying coating to material resistant to melting temperature or cover of material to coating before melting

摘要

The method involves applying a material to a bearer to form a coating, e.g. by deposition, melting the coating and cooling to crystallize it. The coating is applied to a material resistant to the melting temperature or a cover of the material is applied to the coating before melting. The material is chemically inert relative to the coating material and/or an oxide layer is formed between the coating and cover at least during crystallization.