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Interlaminar bond comprises shape memory bond applied to substrate, from polymer layer from thermoplastic polymer
Interlaminar bond comprises shape memory bond applied to substrate, from polymer layer from thermoplastic polymer
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机译:层间键包括从热塑性聚合物的聚合物层施加到基材的形状记忆键
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摘要
The interlaminar bond comprises a shape memory bond applied to a substrate. The shape memory bond is present, depending on the temperature, in a Martensite phase and or in a Austenite phase. The interlaminar bond has at least one polymer layer from a polymer with thermoplastic properties. At a first high temperature the rigidity of the polymer is greater than that of the shape memory bond. At a second higher temperature, the rigidity of the polymer is less than that of the shape memory bond.
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