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Surface mounting type electronic component has extraction ends of internal electrode exposed to end faces of electronic component and exposed sections covered by protective coat

机译:表面安装型电子部件具有暴露于电子部件端面的内部电极的引出端和被保护膜覆盖的暴露部分。

摘要

Terminal electrodes (12-14) are formed on main structure of electronic component (11) by plating, and terminal electrodes (12,14) are respectively on both ends of electronic component. Extraction ends (21a,22a) of internal electrode exposed to end faces (11a,11b) and they are connected with terminal electrode film electrically. The exposed section of extraction ends are covered by protective coat.
机译:端子电极(12-14)通过镀覆形成在电子部件(11)的主体结构上,端子电极(12,14)分别位于电子部件的两端。内部电极的引出端(21a,22a)暴露于端面(11a,11b),并且它们与端子电极膜电连接。萃取端的裸露部分被保护层覆盖。

著录项

  • 公开/公告号DE10030742A1

    专利类型

  • 公开/公告日2001-04-12

    原文格式PDF

  • 申请/专利权人 MURATA MFG. CO. LTD.;

    申请/专利号DE20001030742

  • 发明设计人 SAKAI KENICHI;KOTANI KENICHI;

    申请日2000-06-23

  • 分类号H05K3/32;H03H9/15;H03H9/02;H01G2/06;

  • 国家 DE

  • 入库时间 2022-08-22 01:09:48

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