Process for joining circuit boards comprises overlapping the connecting surface of the first board with the connecting surface of the second board to form a connecting section and heating

摘要

The electrical connecting section for circuit boards is sealed with one part (12a) of resin which represents the insulating substrate (12) of the first board. Joining circuit boards comprises preparing a first circuit board (5) and a second circuit board (2), where the first board has an insulating substrate (12) made of a thermoplastic resin and a conductive pattern (13) with a connecting surface (13a) and the second board has a conductive pattern (11) with a connecting surface (11a); overlapping the connecting surface of the first board with the connecting surface of the second board to form a connecting section; and heating to a temperature above the glass transition temperature of the resin whilst exerting a pressure on the connecting section so the connecting surface of the first board joins to the connecting surface of the second board.